線路板術(shù)語(yǔ)中英文對(duì)照-PCB線路板其他相關(guān)

發(fā)布時(shí)間：2014-09-17 02:41:09 分類(lèi)：資料中心

1、主面：primary side
2、輔面：secondary side
3、支撐面：supporting plane
4、信號(hào)：signal
5、信號(hào)導(dǎo)線：signal conductor
6、信號(hào)地線：signal ground
7、信號(hào)速率：signal rate
8、信號(hào)標(biāo)準(zhǔn)化：signal standardization
9、信號(hào)層：signal layer
10、寄生信號(hào)：spurious signal
11、串?dāng)_：crosstalk
12、電容：capacitance
13、電容耦合：capacitive coupling
14、電磁干擾：electromagnetic interference
15、電磁屏蔽：electromangetic shielding
16、噪音：noise
17、電磁兼容性：electromagnetic compatbility
18、特性阻抗：impedance
19、阻抗匹配：impedance match
20、電感：inductance
21、延遲：delay
22、微帶線：microstrip
23、帶狀線：stripline
24、探測(cè)點(diǎn)：probe point
25、開(kāi)窗口：cross hatching
26、跨距：span
27、共面性（度）：coplanarity
28、埋入電阻：buried resistance
29、黃金板：golden board
30、芯板：core board
31、薄基芯：thin core
32、非均衡傳輸線：unbalanced transmission line
33、閥值：threshold
34、極限值：threshold limit value(TLV)
35、散熱層：heat sink plane
36、熱隔離：heat sink plane
37、導(dǎo)通孔堵塞：via filiing
38、波動(dòng)：surge
39、卡板：card
40、卡板盒/卡板柜：card cages/card racks
41、薄型多層板：thin type multilayer board
42、埋/盲孔多層板：
43、模塊：module
44、單芯片模塊：single chip module (SCM)
45、多芯片模塊：multichip module (MCM)
46、多芯片模塊層壓基板：laminate substrate version of multichip module (MCM-L)
47、多芯片模塊陶瓷基數(shù)板：ceramic substrate version o fmultichip module (MCM-C)
48、多芯片模塊薄膜基板：deposition thin film substrate version of multilayer module (MCM-D)
49、嵌入凸塊互連技術(shù)：buried bump interconnection technology (B2 it)
50、自動(dòng)測(cè)試技術(shù)：automatic test equipment (ATE)
51、芯板導(dǎo)通孔堵塞：core board viafilling
52、對(duì)準(zhǔn)標(biāo)記：alignment mark
53、基準(zhǔn)標(biāo)記：fiducial mark
54、拐角標(biāo)記：corner mark
55、剪切標(biāo)記：crop mark
56、銑切標(biāo)記：routing mark
57、對(duì)位標(biāo)記：registration mark
58、縮減標(biāo)記：reduvtion mark
59、層間重合度：layer to layer registration
60、狗骨結(jié)構(gòu)：dog hone
61、熱設(shè)計(jì)：thermal design
62、熱阻：thermal resistance 來(lái)源：線路板術(shù)語(yǔ)中英文對(duì)照-PCB線路板其他相關(guān)